TSMC fully raises CoWoS capacity targets for 2026-2027

Glonghui, January 29｜According to Taiwan's DigiTimes, TSMC will comprehensively ramp up CoWoS capacity over the next two years. In addition to Nvidia, which has become the largest customer, ASIC chip clients such as Google are also urgently placing orders to secure capacity. TSMC has recently decided to fully raise its CoWoS capacity targets for 2026–2027, and is re-examining its original advanced packaging expansion plans. According to the supply chain, TSMC's Nanke AP8 plant will add another P2 facility, with both plants focusing on CoWoS. Meanwhile, at the Chiayi AP7 plant, which originally focused on WMCM, SoIC, and CoPoS, SoIC will be converted to CoWoS.