SK Hynix and Sandisk launch global standardization process for high-bandwidth flash memory

Glonghui, February 26｜According to Yonhap News Agency, SanDisk and SK Hynix jointly held the HBF Specification Standardization Alliance Kick-off Meeting at the former's headquarters on Wednesday, marking the official launch of the global standardization process for high bandwidth flash memory (HBF) by the two major memory manufacturers. SK Hynix stated that it has partnered with SanDisk to begin standardizing the next-generation storage technology HBF, in order to strengthen its position in the AI chip market. HBF, as a new storage tier positioned between high bandwidth memory (HBM) and solid-state drives, aims to bridge the gap between the high performance of HBM and the large capacity of SSDs, meeting the dual demands of AI inference scenarios for capacity scalability and energy efficiency. The industry generally predicts that integrated memory solutions with HBF as a key component will see comprehensive market expansion around 2030.