Broadcom executive: At least 1 million 3D stacked chips are expected to be sold by 2027

Glonghui, February 26｜Harish Baladwaj, Vice President of Product Marketing at Broadcom (AVGO.O), stated on Wednesday that based on its stacking design technology, the company expects to sell at least 1 million chips by 2027. This forecast marks the launch of a new product by Broadcom and the establishment of a new sales target, which could potentially generate a revenue source worth several billions of dollars. These chips are manufactured using a technology developed by Broadcom that stacks two chips together, allowing different silicon wafers to be tightly connected, thereby increasing the speed at which data is transferred from one chip to another. Baladwaj said that the company's stacking technology enables customers to produce chips with higher performance and lower power consumption to meet the rapidly growing computing demands brought by artificial intelligence software. “Now, almost all of our customers have started adopting this technology,” he said.